Problems with gaseous contaminants in micro electronics industry
Outgassing from materials, process equipment, or cleaning chemicals such as VOCs, Ammonia, Silane, Hydrogen sulphide causing chemical reaction on wafer surfaces leading to defects or compromised circuit functionality
Corrosive gases from etching process cause crrosion on sensitive components including metal interconnects & equipment
Hydrocarbon contaminations form organic residue on wafers causing defects and reduce devise reliability
Ammonia and Amine contamination cause lense hazing in lithography and patterning defects in photo resist material
Implications of gaseous contaminants in micro electronics industry
Reduced product yield, Compromised device reliability, Higher production cost, Equipment degradation, Delayed innovation and production
How can we Help?
Our tailor made advance filtation systems help remove gaseous contaminants from various functional areas of micro electronics set up such as, air intake system, exhaust systems, gas delivery pipelines, photolithography area, etching process area,
